Samsung is developing a new chip package technology called fan-out wafer-level package-HPB (FOWLP-HPB) to prevent overheating in application processors (AP). This technology involves attaching a heat path block (HPB) on top of the SoC and is expected to be used in future Exynos chips.
The Advanced Package (AVP) business unit of Samsung's chip division is leading the development of FOWLP-HPB and aims to complete it by the fourth quarter of 2024, followed by mass production. Samsung is also working on a FOWLP-system-in-package (SIP) technology that can mount multiple dies and is scheduled for launch in the fourth quarter of 2025.
The FOWLP-HPB and FOWLP-SIP technologies both place the HPB on top of the SoC, while the memory is positioned next to the HPB. HPB, which is a heatsink commonly used in server and PC SoCs, is being introduced in smartphones due to their increasing thermal challenges, particularly with the rising adoption of on-device AI.
Samsung’s new FOWLP-HPB tech shows real promise in tackling AP overheating issues, especially with on-device AI pushing thermal limits in smartphones. Integrating a heat path block directly on the SoC could be a game-changer for future Exynos chips. At Mytecharm, we’re keeping a close eye on how this innovation shapes next-gen mobile performance.
This is a much-needed move by Samsung. As mobile devices keep advancing, managing heat from the application processor is critical. Improving chip packaging to reduce overheating can really boost performance and reliability, especially for gaming and multitasking. I recently read an article on Coyyn.com that discussed similar tech innovations — it's a great resource if you're into the future of hardware and cooling solutions.
It’s exciting to see Samsung taking proactive steps toward resolving AP overheating issues with innovative chip packaging technology. Thermal management is becoming increasingly critical as chips grow more powerful in smaller devices. I came across a piece on newscod that touched on similar developments in semiconductor cooling tech, and this move by Samsung seems like a logical next step. Looking forward to seeing how this impacts performance and efficiency in their next-gen devices!
