Samsung, the world leader in semiconductor space, has announced that it has developed a new chip packing technology that could make chips faster and more power-efficient. The I-Cube4 technology is an improvement over the company’s I-Cube 2 technology from 2018 and X-Cube technology from 2020.
The company’s I-Cube4 (Interposer-Cube4) is a 2.5D heterogeneous chip packaging technology. It can be used to horizontally place multiple logic dies (CPU, GPU, and NPU) and several HBM (High Bandwidth Memory) dies on top of a silicon interposer, making several dies act as a single chip. This technology was developed in March 2021, and it has already been used to put one logic die, and four HBM dies on a single chip.
